Carbon Nanotubes for Better 3D Electronics Could Be in Production by 2016

Nextbigfuture.com reports that Researchers at Chalmers have demonstrated that two stacked chips can be vertically interconnected with carbon nanotube vias through the chips. This new method improves possibilities for 3D integration of circuits, one of the most promising approaches for miniaturization and performance promotion of electronics.

There’s more at http://nextbigfuture.com/2012/01/carbon-nanotubes-for-better-3d.html

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